SIPLACE Placement Systems | Electronics Assembly Systems | SIPLACE Features and Options | Versions    |     9/5/2010    11:19 AM
Hide images  |  Print
 

 

Overview Versions
 

SIPLACE MultiStar

 

The world’s only “All-in-One” placement head that combines Collect&Place and Pick&Place modes covering a staggering component range from 01005 to 50x40 mm. The SIPLACE MultiStar eliminates bottleneck and line balancing issues and enables quicker and easier product changeovers than ever before.

 

SIPLACE SpeedStar

 

Placing at a speed of 30,000 cph, the 20 nozzle SIPLACE SpeedStar placement head is also able to pick up even the smallest 01005 components without slowing down. Its advanced direct drive makes it as robust and maintenance-free as it is speedy and reliable.

 
 

SIPLACE TwinStar

 

The high-precision Pick&Place SIPLACE TwinStar is designed to handle large and heavy modules or exotic odd shaped components that requires special customized grippers. Coupled with SIPLACE Digital Vision System, SIPLACE TwinStar provides the Ultimate End of Line Solution!

 

SIPLACE 12-Nozzle Collect&Place Head

 

The proven SIPLACE Collect&Place standard head with 12 nozzles for the efficient placement of components ranging from 0201 to 18.7 x 18.7 mm in mid-volume applications.

 

SIPLACE 6-Nozzle Collect&Place Head

 

With a component spectrum that ranges from 0201 to 27 x 27 mm, this proven SIPLACE
6-nozzle Collect&Place head combines efficient operation with high flexibility.