On-demand SMT-production:
with the new SIPLACE SX
With the SIPLACE SX, you pick and choose - and change - what you need, when you need it. You invest only in your current requirements. That's what we call: Real Capacity on Demand!
Three processes on a single platform:
SIPLACE CA
The new SIPLACE CA is the world's first platform that combines die placement from wafers (Flip Chip&Die Attach) with classic SMT placement technology in a single machine.
The revolution in electronics production:
SIPLACE MultiStar CPP Head
The SIPLACE MultiStar is the world’s only placement head that combines the Collect & Place and Pick & Place modes in a single unit. You no longer switch out placement heads or configurations; instead, the SIPLACE MultiStar automatically selects the mode that works best.
