Machine Overview

Performance

IPC-Value/Gantry

Die/Component
Spectrum (mm²)*

Accuracy

Flip Chip

9,000

0.8 - 18.7

± 10 μm/3σ

Die Attach

6,500

0.8 - 18.7

± 10 μm/3σ

SMT

20,000

01005 - 18.7

± 41 μm/3σ

Configuration**

SIPLACE CA4

SIPLACE CA4

SIPLACE CA4

-

SWS

4

2

0

BE-Wagen

-

2

4

Köpfe

4

4

4

*Information based on 20-nozzle and 12-nozzle Collect&Place head.
**Further configurations available.